KINGBO RMA-218 10cc Solder Flux Paste/BGA flux paste
KINGBO RMA-218 10cc is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates. Good formula for BGA rebelling / balls worksite can stick the balls much more.
